JPS5152308Y2 - - Google Patents

Info

Publication number
JPS5152308Y2
JPS5152308Y2 JP1973139269U JP13926973U JPS5152308Y2 JP S5152308 Y2 JPS5152308 Y2 JP S5152308Y2 JP 1973139269 U JP1973139269 U JP 1973139269U JP 13926973 U JP13926973 U JP 13926973U JP S5152308 Y2 JPS5152308 Y2 JP S5152308Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1973139269U
Other languages
Japanese (ja)
Other versions
JPS5081770U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973139269U priority Critical patent/JPS5152308Y2/ja
Priority to GB4444774A priority patent/GB1454188A/en
Priority to DE2451018A priority patent/DE2451018C3/de
Priority to US05/519,051 priority patent/US4003074A/en
Priority to CA214,297A priority patent/CA1027222A/en
Publication of JPS5081770U publication Critical patent/JPS5081770U/ja
Application granted granted Critical
Publication of JPS5152308Y2 publication Critical patent/JPS5152308Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1973139269U 1973-12-03 1973-12-03 Expired JPS5152308Y2 (en])

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1973139269U JPS5152308Y2 (en]) 1973-12-03 1973-12-03
GB4444774A GB1454188A (en]) 1973-12-03 1974-10-14
DE2451018A DE2451018C3 (de) 1973-12-03 1974-10-26 Injektions-Halbleiterlasereinrichtung
US05/519,051 US4003074A (en) 1973-12-03 1974-10-29 Hermetically-sealed injection semiconductor laser device
CA214,297A CA1027222A (en) 1973-12-03 1974-11-21 Hermetically sealed injection semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973139269U JPS5152308Y2 (en]) 1973-12-03 1973-12-03

Publications (2)

Publication Number Publication Date
JPS5081770U JPS5081770U (en]) 1975-07-14
JPS5152308Y2 true JPS5152308Y2 (en]) 1976-12-14

Family

ID=28414821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973139269U Expired JPS5152308Y2 (en]) 1973-12-03 1973-12-03

Country Status (1)

Country Link
JP (1) JPS5152308Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53111718A (en) * 1977-03-11 1978-09-29 Japan Synthetic Rubber Co Ltd Sensitive resin conposite

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595985Y2 (ja) * 1976-12-29 1984-02-23 富士通株式会社 光半導体装置
JP2012156549A (ja) * 2009-10-30 2012-08-16 Sony Corp 光増幅装置
JP2011119630A (ja) * 2009-10-30 2011-06-16 Sony Corp 光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53111718A (en) * 1977-03-11 1978-09-29 Japan Synthetic Rubber Co Ltd Sensitive resin conposite

Also Published As

Publication number Publication date
JPS5081770U (en]) 1975-07-14

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